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product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays. 1/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 datashee t max 104 segments (seg26com4) multifunction lcd segment driver BU97941FV-LB this is the product guarantees long time support in industrial market. features ? long time support product for industrial applications. ? integrated ram for display data (ddram): 26 x 4 bit (max 104 segments) ? lcd drive output: 4 common output, 26 segment output ? integrated 4ch led driver circuit ? support standby mode ? integrated power-on-reset circuit (por) ? integrated oscillator circuit ? no external component ? low power consumption design ? independent power supply for lcd driving applications ? industrial equipment ? telephone ? fax ? portable equipment (pos, ecr, pda etc.) ? dsc ? dvc ? car audio ? home electrical appliance ? meter equipment etc. typical application circuit key specifications supply voltage range: +1.8v to +3.6v lcd drive power supply range: +2.7v to +5.5v operating temperature range: -40c to +85c max segments: 104 segments display duty: static, 1/3, 1/4 selectable bias: static, 1/3 interface: 3wire serial interface package w (typ.) x d (typ.) x h (max.) figure 1. typical application circuit ssop-b40 13.60mm x 7.80mm x 2.00mm signal input from controller about resistor value: determine the optimal value based on the applied current with 25ma as max per 1 port 5.0v 3.3v vlcd vdd csb sd scl vss BU97941FV-LB lcd com0 to com3 seg0 to seg25 led1 vled=5.0 led2 led3 led4
datasheet datasheet 2/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) block diagram / pin configuration / pin description figure 2. block diagram figure 3. pin configuration (top view) table 1. pin description pin name pin no. i/o setting when not in use function csb 26 i vdd chip select: "l" active scl 27 i vss serial data transfer clock sd 28 i vss input serial data vdd 29 - - power supply for logic vss 25 - - external clock input terminal (for display/pwm using selectable) support hi-z input mode at internal clock mode vlcd 30 - - gnd com0 to 3 31 to 34 o open power supply for lcd seg0 to 25 1 to 20 35 to 40 o open common output for lcd led1 to 4 21 to 24 o open led driver output common counter oscillator lc d bias selector common dr ive r power on reset sd scl / clkin vss vss com0??com3 seg0??seg2 5 if fi lte r seri al inter fac e ddram lcd voltage generator command regis ter data decoder vlcd csb vdd segment driver led driver led4...led1 external clock line led4 led3 led2 led1 1 20 21 40 vss csb scl sd vdd vlcd com3 com2 com1 com0 seg4 seg3 seg1 seg0 seg5 seg9 seg10 seg11 seg12 seg7 seg8 seg15 seg16 seg17 seg18 seg13 seg14 seg19 seg20 seg23 seg24 seg25 seg21 seg22 seg6 seg2
datasheet datasheet 3/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) absolute maximum ratings (vss=0v) item symbol ratings unit remarks power supply voltage1 vdd -0.3 to +4.5 v power supply power supply voltage2 vlcd -0.5 to +7.0 v voltage for liquid crystal display power supply voltage2 vled -0.5 to +7.0 v voltage for led driving port terminal power dissipation pd 0.8 (note1) w input voltage range vin -0.5 to vdd+0.5 v operating temperature range topr -40 to +85 c storage temperature range tstg -55 to +125 c output current iout1 5 ma seg output iout2 5 ma com output iout3 50 ma led output (per 1 port) (note1) decreases 8mw per 1c when using at 1 ta=25 c or higher. (during rohm standard board mounting) (board size 74.2mm 74.2mm 1.6mm material fr4 glass-epoxy board copper foil land pattern only) caution: operating the ic over the absolut e maximum ratings may damage the ic. the dam age can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=-40c to +85c, vss=0v) item symbol min typ max unit remarks power supply voltage1 vdd 1.8 - 3.6 v power supply power supply voltage2 vlcd 2.7 - 5.5 v voltage for liquid crystal display output current iout1 - - 25 ma led output (per led1 port) iout2 - - 100 ma led output (led port current total sum) electrical characteristics dc characteristics (ta=-40c to +85c, vdd=1.8v to 3.6v , vlcd=2.7v to 5.5v, vss=0v) item symbol limit value unit condition min typ max ?h? level input voltage vih 0.8vdd - vdd v sd, scl, csb ?l? level input voltage vil vss - 0.2vdd v sd, scl, csb hysteresis width vh - 0.2 - v scl, vdd=3.3v, ta=25c ?h? level input current iih1 - - 5 a sd,scl, csb, vi=3.6v led off leak off leak 5 0 5 a led vi=5.5v ?h? level output voltage (note2) voh1 vlcd -0.4 - - v iload=-50a, vlcd=5.0v seg0 to seg25 voh2 vlcd -0.4 - - v iload=-50a, vlcd=5.0v com0 to com3 ?l? level output voltage (note2) vol1 - - 0.4 v iload= 50a, vlcd=5.0v seg0 to seg25 vol2 - - 0.4 v iload= 50a, vlcd=5.0v com0 to com3 vol4 - 0.11 0.5 v iload=20ma, vlcd=5.0v led1 to 4 output voltage (note2) vout1 2.73 3.33 3.93 v iload=50a, vlcd=5.0v, seg0 to 25, com0 to 3 vout2 1.07 1.67 2.27 v iload=50a, vlcd=5.0v, seg0 to 25, com0 to 3 supply current (note1) istvdd - 3 10 a input pin all ?l?, display off, oscillation off istvlcd - 0.5 5 a input pin all ?l?, display off, oscillation off ivdd1 - 8 15 a vdd=3.3v, ta=25c 1/3bias, ffr=64hz, output open ivlcd1 - 10 15 a vlcd=5.0v, ta=25c 1/3bias, ffr=64hz, output open (note1) during power save mode 1, frame inversion. (note2) iload when setting the load of 1 pin only.
datasheet datasheet 4/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) electrical characteristics ? continued oscillation frequency characteristics (ta=-40c to + 85c, vdd=1.8v to 3.6v, vlcd=2.7v to 5.5v, vss=0v) item symbol limit value unit condition min typ max frame frequency 1 ffr1 76.5 85 93.5 hz vdd=3.3v, ta=25c, ffr=85hz setting frame frequency 2 ffr2 68 85 97.0 hz vdd=2.5v to 3.6v, ffr=85hz setting frame frequency 3 ffr3 59.7 - 68 hz vdd=1.8v to 2.5v, ffr=85hz setting mpu interface characteristics (ta=-40c to +85c, vdd=1.8v to 3.6v, vlcd=2.7v to 5.5v, vss=0v ) item symbol limit value unit condition min typ max input rise time - - 50 ns input fall time f - - 50 ns scl cycle tscyc 250 - - ns ?h? scl pulse width tshw 50 - - ns ?l? scl pulse width tslw 50 - - ns sd setup time tsds 50 - - ns sd hold time tsdh 50 - - ns csb setup time tcss 50 - - ns csb hold time tcsh 50 - - ns ?h? csb pulse width tchw 50 - - ns figure 4. serial interface timing csb scl sd tcsh tscyc tsl w tshw tsds tsdh t f tr tcss tchw
datasheet datasheet 5/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) i/o equivalence circuit figure 5. i/o equivalence circuit example of recommended circuit figure 6. recommended circuit example vdd vss vlcd vss vlcd seg0-25 com0-3 vss led1-4 vss vdd csb, sd, scl,clkin vss signal input from controlle r a bout resistor value determine the optimal value based on the applied current with 25ma as max per 1 port 5.0v 3.3v vlcd vdd csb sd scl vss BU97941FV-LB lcd com0 to com3 seg0 to seg25 led1 vled=5.0v led2 led3 led4
datasheet datasheet 6/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) function description command /data transfer method 3-spi (3-wire serial interface this device is controlled by a 3-wire signal: csb, scl, sd. first, interface counter is initialized with csb=?h?. setting csb = ?l? enables sd and scl inputs. each command starts with command or data judgment bit (d/c) as msb data, followed by d6 to d0 (this is while csb=?l). internal data is latched at the rising edge of scl, and then the data is converted to an 8-bit parallel data at the falling edge of the 8th clk. when csb changes from ?l? to ?h? and the data being transferred is less than 8 bits, command and data being transferred will be cancelled. to start sending command again, please set csb to ?l?. then, be sure to input a 1-byte command. also, when ddram data becomes input state through ra mwr command, the device cannot accept command inputs. in order to input again, please start up csb. if csb is set to ?h?, the data input state is cancelled and if ?csb? is set to ?l? again, command will be received. figure 7. 3-spi data transfer format write and transfer method of display data this device has display data ram of 264=104bit. the handling of display data with write and the handlin g of ddram data and address and display are as follows: binary 8-bit data is written to ddram. the starting address is set with the address set command, and is automatically incremented per 4bit data received. next, by transferring data, data can be written continuously to ddram. (when continuously writing data to ddram, after writing to the final address 19h(seg25), address will return to 00h (seg0) through auto increment.) ddram address 00 01 02 03 04 05 06 07 ??? 17h 18h 19h bit 0 a e i m com0 1 b f j n com1 2 c g k o com2 3 d h l p com3 seg 0 seg 1 seg 2 seg 3 seg 4 seg 5 seg 6 seg 7 seg 23 seg 24 seg 25 d/ c d/ c d3 d6 d0 d0 d6 d 6 d 5 d 4 d 3 d1 d 0 d/c d4 d3 d2 d1 scl csb sd d/c 3rd byte command d2 1st byte command 2nd byte command d 4 d 6 d 5 d1 d 2 d5 10000011 1s t by te command a b c d e f g h i j k l m n o p onwards display data 00000000 a ddress set command 10100000 ram write 2n d b yte command
datasheet datasheet 7/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) writing to ram is done per 4bit. when csb is set to ?h? a nd the data is less than 4 bits , the writing of ram will be cancelled. (transfer of command is done per 8bit.) figure 8. display data transfer method d0 d7 d5 address 31h display data d5 d6 1st byte command / 2nd byte command d4 d3 d2 address set command d0 internal signal ram write address 00h address 01h csb address 00h d4 d4 d2 d1 d5 d3 internal signal ram write scl d7 d6 sd 1st byte command / 2nd byte command display data address 02h d6 d5 d4 d3 d7 d1 address set command scl csb sd d2 ram write command d5 d4 d3 d2 d1 d0 returns to 0 through auto increment command command ram write command d7 d6 ram write per 4bit when csb='h' is set and less than 4bit, writin g is cancelled. address 00h address 30h
datasheet datasheet 8/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) lcd driver bias / duty circuit voltage is generated for lcd driver. buffer amplifier is integrated with low power consumption possible. (noet1) line and frame inversion can be set by modeset command. (note2) 1/4duty, 1/3duty, and static duty can be set by disctl command. for each liquid crystal display waveform, re fer to ?liquid crystal display waveform?. reset initial state the default condition after executing software reset is as follows: display is turned off each command register enters reset state ddram address is initialized (note) ddram data is not initialized. therefore, it is recommended to write initial values to all ddram before display on. command / function table function description table no command function 1 mode set (modeset) liquid crystal display setting 2 display control (disctl) lcd setting1 3 address set (adset) lcd setting2 4 led control (ledctl) led board on/off setting 5 ram write (ramwr) ram write start setting 6 all pixel on (apon) all display on 7 all pixel off (apoff) all display off 8 all pixel on/off mode off (noron) normal display apon/apoff setting release 9 software reset (swrst) software reset
datasheet datasheet 9/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) command description d/c (msb) is a bit for command or data judgment. for details, see 3-wire serial interface command, data transfer method. 1. mode set command (modeset) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 0 0 0 1 81h - 2nd byte command 0 0 0 0 p3 p2 p1 p0 - 00h display setting setting p3 reset state display off 0 display on 1 display off oscillation circuit operation off, liquid crystal po wer supply circuit operation off with frame cycle. display off state (output vss level) display on oscillation circuit operation on, liquid crystal power supply circuit on. read operation from ddram starts. display on state with frame cycle. (note) led port is not affected by the on/off state of display. the output state of led port is determined by the setting of the ledctl command. liquid crystal drive waveform setting setting p2 reset state frame inversion 0 line inversion 1 power save mode (low current consumption mode) setting setting p1 p0 reset state power save mode1 0 0 power save mode2 0 1 normal mode 1 0 high power mode 1 1 (note) use high power mode at vlcd 3v or higher. (reference current consumption data) setting current consumption power save mode 1 1.0 power save mode 2 1.7 normal mode 2.7 high power mode 5.0 (note) the current consumption data above is re ference data and changes according to panel load.
datasheet datasheet 10/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) 2. (2)display control command (disctl) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 0 0 1 0 82h - 2nd byte command 0 0 0 0 p3 p2 p1 p0 - 02h duty setting setting p3 p2 reset state 1/4duty (1/3bias) 0 0 1/3duty (1/3bias) 0 1 static (1/1bias) 1 * (*: don?t care) at 1/3duty setting, the display / blink data for com3 are invalid. (com3: same waveform with com1) at 1/1duty (static) setting, the display / blink data for com1 to 3 are invalid. (note) com1 to 3: same waveform with com0 be careful in sending display data. for sample output waveform of seg/com with dut y setting, see "liquid crystal display waveform". frame frequency setting setting (when 1/4,1/3,1/1duty) p1 p0 reset state (128hz, 130hz, 128hz) 0 0 (85hz, 86hz, 64hz) 0 1 (64hz, 65hz, 48hz) 1 0 (51hz, 52hz, 32hz) 1 1 the relationship with frame frequency (fr), internal osc frequency and dividing number is below: disctl (p1,p0) divide fr [hz] 1/4duty 1/3duty 1/1duty 1/4duty 1/3duty 1/1duty (0,0) 160 156 160 128 131.3 128 (0,1) 240 237 320 85.3 86.4 64 (1,0) 320 315 428 64 65 47.9 (1,1) 400 393 640 51.2 52.1 32 when calculating the osc frequency from the measurement value of frame frequency, us e the following equation: ? osc frequency = frame frequency (measurement value) dividing number? dividing number: using the values of frame frequency setting (p1, p0) and duty setting (p3, p2), determine the values from the table above. ex) (p1,p0)= (0,1), (p3,p2)= (0,1) ? dividing number= 237 (note) the value of fr in the table above is the fr ame frequency calcuated as osc frequency = 20.48khz (typ).
datasheet datasheet 11/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) 3. address set command (adset) msb lsb msb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 0 0 1 1 83h - 2nd byte command 0 0 0 p4 p3 p2 p1 p0 - 00h sets the starting ram address for normal display. address can be set from 00h to 1bh. setting is prohibited for addresses not written above. address during reset is 00h. when writing to ram, a separate ram write setting is needed. 4. led control command (ledctl) msb lsb msb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 0 0 1 0 1 85h - 2nd byte command 0 0 0 0 p3 p2 p1 p0 - 00h sets the driver of the led port. setting during reset is 00h. the relationship between each parameter and the drive board is as follows: led1 p0 led2 p1 led3 p2 led4 p3 led on 1 1 1 1 led off 0 0 0 0 (note) please input csb="h" after ledctl command is issued. to avoid noise and reset interface. 5. ram write command (ramwr) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 1 0 0 0 0 0 a0h - 2nd byte command display data random ???? n th byte command display data random the input data after command setting is the data input for display. be sure to send this command after setting the adset command. the display data is transferred per 4bit. (for details, see ?write and transfer method of display data.?) 6. all pixel on command (apon) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 0 0 0 1 91h - regardless of the contents of ddram, the seg output will enter all light up mode. (pin that selects seg output)
datasheet datasheet 12/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) 7. all pixel off command (apoff) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 0 0 0 0 90h - regardless of the contents of ddram, the seg output will enter all light up mode. (pin that selects seg output) 8. all pixel on/off mode off (noron) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 0 0 1 1 93h - apon / off mode is cancelled and switches to norma l display mode. (pin that selects seg output) after reset, noron is set and becomes normal display state. 9. software reset command (swrst) msb lsb d/c d6 d5 d4 d3 d2 d1 d0 hex reset 1st byte command 1 0 0 1 0 0 1 0 92h - this ic will be reset by this command.
datasheet datasheet 13/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) liquid crystal drive waveform figure 9. lcd drive waveform during line inversion figure 10. lcd drive waveform during frame inversion 1/4duty line inversion frame inversion 1frame 1frame com0 com0 com1 com1 com2 com2 com3 com3 segn segn segn+1 segn+1 segn+2 segn+2 segn+3 segn+3 statea state a (com0-segn) (com0-segn) stateb stateb (com1-segn) (com1-segn) com1 stateb com2 com3 segn+2segn+3 com0 state a segn segn+1 segn+2segn+3 com3 state a segn segn+1 com0 com1 com2 stateb vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg
datasheet datasheet 14/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) figure 11. lcd drive waveform during line inversion figure 12. lcd drive waveform during frame inversion 1/3dut y line inversion frame inversion 1frame 1frame com0 com0 com1 com1 com2 com2 com3 com3 segn segn segn+1 segn+1 segn+2 segn+2 segn+3 segn+3 state a state a (com0-segn) (com0-segn) stateb stateb (com1-segn) (com1-segn) com1 stateb com2 com3 segn+2 segn+3 com0 state a segn segn+1 segn+2 segn+3 com3 state a segn segn+1 com0 com1 com2 stateb vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg when 1/3duty com3 waveform output is same as com1 when 1/3duty com3 waveform output is same as com1 when 1/3duty com3 waveform output is same as com1
datasheet datasheet 15/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) figure 13.lcd drive waveform during line inversion figure 14. lcd drive waveform during frame inversion vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vss vreg vreg -vreg vreg -vreg vss vreg when 1/1duty (static) com1 same waveform as com0 com2 same waveform as com0 com3 same waveform as com0 when 1/1duty (static) com1 / com0 is same waveform com2 / com0 is same waveform com3 / com0 is same waveform when 1/1duty (static) com1 same waveform as com0 com2 same waveform as com0 com3 same waveform as com0 1/1duty (static) line inversion frame inversion 1frame 1frame com0 com0 com1 com1 com2 com2 com3 com3 segn segn segn+1 segn+1 segn+2 segn+2 segn+3 segn+3 state a state a stateb stateb com2 com3 stateb stateb com1 segn+2 segn+3 com0 state a segn segn+1 segn+2 segn+3 com3 state a segn segn+1 com0 com1 com2
datasheet datasheet 16/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) initialization sequence execute the following sequence after power supply and start display after the ic has initialized. power supply csb ?h? ?initialize i/f csb ?l? ?start i/f data transfer execute software reset from swrst command modeset (display off) various command setting ram write modeset (display on) start display after inserting power supply, each register value, ddram addr ess and ddram data are random prior to initialization.
datasheet datasheet 17/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) caution during power supply on/off por circuit during power supply rise, because the ic internal circuit and reset pass through an area of unstable low voltage and vdd starts up, there is a risk that the insi de of the ic is not completely reset and wr ong operation might occur. in order to prevent this, p.o.r circuit and so ftware reset functions are incorporated. in or der to ensure that oper ation, do as follows during power supply rise: 1. set power up conditions to meet the recommended tr, tof f and vbot specs below in order to ensure por operation. (por circuit uses vdet type) (note) the voltage detection of por differs depending on the used environment etc. in order to assure the operati on of por, it is recommended to make vbot = 0.5v or lower. figure 15. rise waveform 2. when the conditions are not met, do the following countermeasures after power supply on: 1. set csb to ?h?. 2. turn on the csb and execute swrst command. in order for the swrst command to take effect for sure, it is recommended to start up csb after 1ms after the vdd level has reached 90%. since the state is irregular until swrst command input af ter power supply on, countermeasure through software reset is not the perfect substitute for p.o.r f unction so it is important to be careful. figure 16. swrst command sequence vdd csb min 1ms min 50ns swrst command recommended conditions of tr, toff, vbot tr toff vbot vdet 10ms or lower 1ms or higher 0.5v or lower typ 1.2 v vdd tr toff vbot (note) vdet is integrated por detection level vdet
datasheet datasheet 18/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) attention about using ledctl (85h) command please input csb="h" after ledctl command is issued. to avoid noise and reset interface. figure 17. recommended sequence when using ledctl (85h) command attention about input port pull down satisfy the following sequence if input terminals are pu lled down by external resistors (in case mpu output hi-z). figure 18. recommended sequence when input ports are pulled down BU97941FV-LB adopts a 5v tolerant i/o for t he digital input. this circuit includes a bus-hold function to keep the level of high. a pull down resistor of below 10k ? shall be connected to the input terminals to transit from high to low because the bus-hold transistor turns on during t he input?s high level. (refer to the figure 5. i/o equivalent circuit) a higher resistor than 10k ? (approximate) causes input terminals being steady by intermediate potential between high and low level so unexpected current is consumed by the system. the potential depends on the pull down resistance and bus-hold transistor?s resistance. as the bus-hold transistor turns off upon the input level cleared to low a higher resistor can be used as a pull down resistor if an mpu sets sd and scl lines to low before it releases the lines. the low period preceding the mpu?s bus release shall be at least 50ns as same as a minimum clk width (tslw). 0 d/c 0 0 1p0 d6 d6 d5 d4 d3 d1 d0 d/c 0 p3 p2 p1 scl csb sd 1 2nd command 1 ledctl (85h) 0 0 0 0 d2 0 parameter scl sd csb date transaction period with mpu input "l" period input"hi-z" period
datasheet datasheet 19/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capa citor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic duri ng assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
datasheet datasheet 20/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) operational notes ? continued 11. unused input pins input pins of an ic are oft en connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction th rough the transistor and cause unexpected operation of the ic. so unless otherwise specif ied, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interferen ce among circuits, operational faults, or physical damage. therefore, conditions which c ause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore , do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in t he electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automat ically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transit ioning of the protection circuit.
datasheet datasheet 21/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) ordering information b u 9 7 9 4 1 f v - l b e 2 part number package product class lb for industrial applications packaging and forming specification e2: embossed tape and reel ( ssop-b40 ) fv : ssop-b40 marking diagram ssop-b40 (top view) bu97941 part number marking lot numbe r 1pin mark
datasheet datasheet 22/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) physical dimension, tape and reel information package name ssop-b40 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin (max 13.95 (include. burr)
datasheet datasheet 23/23 tsz02201-0p4p0d300500-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 BU97941FV-LB max 104 segments (seg26com4) revision history date revision changes 23.aug.2013 001 new release 26.feb.2014 002 delete sentence ?and log life cycle? in general description and futures. applied new style (change of the size of the title).
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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